Competences

  • Scanning Electron Microscopy (SEM)
  • Analytical Transmission Electron Microscopy (TEM)
  • Focused Ion Beam Technique (FIB)
  • REM with Energy Dispersive X-ray Micro Analysis (EDX) for Elemental Analysis

  • Atomic Force Acoustic Microscopy (AFAM))
  • Surface Potential Microscopy
  • Electrochemical Scanning Tunneling Microscopy (STM)

  • X-ray Photoelectron Spectroscopy (XPS)
  • Secondary Ion Mass Spectroscopy (SIMS)
  • Atom Probe Tomography
  • Fourier Transform Infrared Spectroscopy (FTIR) and Raman

  • Nano X-ray Microscopy / Nano X-ray Computed Tomography
  • X-ray / EUV Reflectometry & Module Development
  • X-Ray Diffraction Mapping
  • Temperature-dependent X-Ray Diffraction (XRD)

  • Nano X-ray Microscopy / Nano X-ray Computed Tomography
  • Photoemission Electron Microscopy (PEEM)
  • Spectroscopy (XPS, XAS)

  • Thin film analysis / Ellipsometry
  • White Light Interferometry
  • Confocal Laser Scanning Microscopy
  • Metallography

  • Nanoindentation
  • Atomic Force Microscopy (AFM)
  • Laser-Acoustic Testing

  • Deformation Analysis - microDAC, nanoDAC
  • Quantification of Strain Fields
  • Residual Stress Analysis

  • Particle Size
  • Behavior in Suspensions
  • Toxicology

  • Review SEM with FIB
  • X-Ray Diffraction (XRD)
  • Spectral Ellipsometer

  • 3D Wafer-Level System Integration
  • 300 mm Cu TSV Technology
  • 300 mm Wafer-Level Assembly and Stacking

  • Technology aware Modelling
  • Simulation and Modelling Methods
  • Design under Constraints