Competences

Dresden Fraunhofer Cluster Nanoanalysis

Kompetenzen der Partner

  • Electron and Ion Microscopy

    • Scanning Electron Microscopy (SEM)
    • Analytical Transmission Electron Microscopy (TEM)
    • Focused Ion Beam Technique (FIB)

  • Scanning Probe Microscopy

    • Atomic Force Acoustic Microscopy (AFAM))
    • Surface Potential Microscopy
    • Electrochemical Scanning Tunneling Microscopy (STM)

  • Spectroscopic Techniques

    • X-ray Photoelectron Spectroscopy (XPS)
    • Secondary Ion Mass Spectroscopy (SIMS)
    • Atom Probe Tomography

  • X-ray Analysis

    • Nano X-ray Microscopy / Nano X-ray Computed Tomography
    • X-ray / EUV Reflectometry & Module Development
    • Temperature-dependent X-Ray Diffraction (XRD)

  • Synchrotron Radiation Studies

    • Nano X-ray Microscopy / Nano X-ray Computed Tomography
    • Photoemission Electron Microscopy (PEEM)
    • Spectroscopy (XPS, XAS)

  • Optical Techniques

    • Thin film analysis / Ellipsometry
    • White Light Interferometry
    • Metallography

  • Nanomechanical Techniques

    • Nanoindentation
    • Atomic Force Microscopy (AFM)
    • Laser-Acoustic Testing

  • Digital Image Correlation Techniques

    • Deformation Analysis - microDAC, nanoDAC
    • Quantification of Strain Fields
    • Residual Stress Analysis

  • Characterization of Nanoparticles

    • Particle Size
    • Behavior in Suspensions
    • Toxicology

  • Inline Metrology

    • Review SEM with FIB
    • X-Ray Diffraction (XRD)
    • Spectral Ellipsometer

  • System Integration

    • 3D Wafer-Level System Integration
    • 300 mm Cu TSV Technology
    • 300 mm Wafer-Level Assembly and Stacking

  • Design and Design Support

    • Technology aware Modelling
    • Simulation and Modelling Methods
    • Design under Constraints