Events

Next Seminar

February 3, 2021, 3:00 p.m. CET
 

A novel in-situ 4-point-bend system for stress impact analysis

with Christoph Sander
(Fraunhofer IKTS, Nanomechanics and Reliability for Microelectronics)

A novel in-situ 4-point bending system was developed at Fraunhofer IKTS to characterize the influence of mechanical stress on e.g., microelectronic devices, thin film systems, novel materials, etc. On the strength of the low build height of the system, the setup with clamped samples can be used in-situ in several tools like Nanoindenters, SEMs or Raman systems. Due to the homogeneous bending moment between the inner support points, the sample region that can be studied under stress is relatively large. Additionally, based on the innovative sample mounting, tensile and compressive stress ca be alternatingly applied on the specimen surface without changing the setup and unmounting the sample.

Get more information on the Fraunhofer IKTS webpage.