Competences

Electron | ion microscopy

  • Scanning electron microscopy (SEM)
  • Analytical transmission electron microscopy (TEM)
  • Focused ion beam technique (FIB)
  • REM with energy dispersive X-ray micro analysis (EDX) for elemental analysis

Scanning probe
microscopy

  • Atomic force acoustic microscopy (AFAM)
  • Surface potential microscopy
  • Electrochemical scanning tunneling microscopy (STM)

Spectroscopic techniques

  • X-ray photoelectron spectroscopy (XPS)
  • Secondary ion mass spectroscopy (SIMS)
  • Atom probe tomography
  • Fourier transform infrared spectroscopy (FTIR) and raman

X-ray analysis

  • Nano X-ray microscopy | Nano X-ray computed tomography
  • X-ray | EUV reflectometry and module development
  • X-Ray diffraction mapping
  • Temperature-dependent X-ray diffraction (XRD)

System integration

  • 3D wafer-level system integration
  • 300 mm Cu TSV technology
  • 300 mm wafer-level assembly and stacking

Optical techniques

  • Thin film analysis | ellipsometry
  • White light interferometry
  • Confocal laser scanning microscopy
  • Metallography

Nanomechanical techniques

  • Nanoindentation
  • Atomic force microscopy (AFM)
  • Laser-acoustic testing

Inline metrology

  • Review SEM with FIB
  • X-Ray diffraction (XRD)
  • Spectral ellipsometer

Characterization of nanoparticles

  • Particle size
  • Behavior in suspensions
  • Toxicology

Synchrotron radiation
studies

  • Nano X-ray microscopy | nano X-ray computed tomography
  • Photoemission electron microscopy (PEEM)
  • Spectroscopy (XPS, XAS)

Digital image correlation techniques

  • Deformation analysis (microDAC, nanoDAC)
  • Quantification of strain fields
  • Residual stress analysis

Design and design support

  • Technology aware modelling
  • Simulation and modelling methods
  • Design under constraints