Electron | ion microscopy
- Scanning electron microscopy (SEM)
- Analytical transmission electron microscopy (TEM)
- Focused ion beam technique (FIB)
- REM with energy dispersive X-ray micro analysis (EDX) for elemental analysis
Scanning probe
microscopy
- Atomic force acoustic microscopy (AFAM)
- Surface potential microscopy
- Electrochemical scanning tunneling microscopy (STM)
Spectroscopic techniques
- X-ray photoelectron spectroscopy (XPS)
- Secondary ion mass spectroscopy (SIMS)
- Atom probe tomography
- Fourier transform infrared spectroscopy (FTIR) and raman
X-ray analysis
- Nano X-ray microscopy | Nano X-ray computed tomography
- X-ray | EUV reflectometry and module development
- X-Ray diffraction mapping
- Temperature-dependent X-ray diffraction (XRD)
System integration
- 3D wafer-level system integration
- 300 mm Cu TSV technology
- 300 mm wafer-level assembly and stacking
Optical techniques
- Thin film analysis | ellipsometry
- White light interferometry
- Confocal laser scanning microscopy
- Metallography
Nanomechanical techniques
- Nanoindentation
- Atomic force microscopy (AFM)
- Laser-acoustic testing
Inline metrology
- Review SEM with FIB
- X-Ray diffraction (XRD)
- Spectral ellipsometer
Characterization of nanoparticles
- Particle size
- Behavior in suspensions
- Toxicology
Synchrotron radiation
studies
- Nano X-ray microscopy | nano X-ray computed tomography
- Photoemission electron microscopy (PEEM)
- Spectroscopy (XPS, XAS)
Digital image correlation techniques
- Deformation analysis (microDAC, nanoDAC)
- Quantification of strain fields
- Residual stress analysis
Design and design support
- Technology aware modelling
- Simulation and modelling methods
- Design under constraints
Dresden Fraunhofer Cluster Nanoanalysis