Dresden Fraunhofer Cluster Nanoanalysis- Scanning Electron Microscopy (SEM)
- Analytical Transmission Electron Microscopy (TEM)
- Focused Ion Beam Technique (FIB)
- REM with Energy Dispersive X-ray Micro Analysis (EDX) for Elemental Analysis
Competences
Tabbed contents
Electron and Ion Microscopy
Scanning Probe Microscopy
- Atomic Force Acoustic Microscopy (AFAM))
- Surface Potential Microscopy
- Electrochemical Scanning Tunneling Microscopy (STM)
Spectroscopic Techniques
- X-ray Photoelectron Spectroscopy (XPS)
- Secondary Ion Mass Spectroscopy (SIMS)
- Atom Probe Tomography
- Fourier Transform Infrared Spectroscopy (FTIR) and Raman
X-ray Analysis
- Nano X-ray Microscopy / Nano X-ray Computed Tomography
- X-ray / EUV Reflectometry & Module Development
- X-Ray Diffraction Mapping
- Temperature-dependent X-Ray Diffraction (XRD)
Synchrotron Radiation Studies
- Nano X-ray Microscopy / Nano X-ray Computed Tomography
- Photoemission Electron Microscopy (PEEM)
- Spectroscopy (XPS, XAS)
Optical Techniques
- Thin film analysis / Ellipsometry
- White Light Interferometry
- Confocal Laser Scanning Microscopy
- Metallography
Nanomechanical Techniques
- Nanoindentation
- Atomic Force Microscopy (AFM)
- Laser-Acoustic Testing
Digital Image Correlation Techniques
- Deformation Analysis - microDAC, nanoDAC
- Quantification of Strain Fields
- Residual Stress Analysis
Characterization of Nanoparticles
- Particle Size
- Behavior in Suspensions
- Toxicology
Inline Metrology
- Review SEM with FIB
- X-Ray Diffraction (XRD)
- Spectral Ellipsometer
System Integration
- 3D Wafer-Level System Integration
- 300 mm Cu TSV Technology
- 300 mm Wafer-Level Assembly and Stacking
Design and Design Support
- Technology aware Modelling
- Simulation and Modelling Methods
- Design under Constraints